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Job Position Information

Code: C6029
Power Semiconductor Die Bond Process Engineer
This is a regular Job Posting
Employer: 恒诺微电子(嘉兴)有限公司
Working Place: Hangzhou
Office Address: 浙江省嘉兴市秀洲工业园区新塍镇恒诺路18号
Job Type: Full Time
Industry & Field: Semiconductors
Vacancies: 1
Salary: Monthly Salary: RMB (CNY) 18,000 to 25,000
Phone Number: 0573-83528161
Contact Name: Eva
Refresh Date: Aug. 18, 2022
Expiration Date: Aug. 23, 2022     Expired
Job Description: 
1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science or equivalent
2) Min 3 years' experience in Discrete or Module semiconductor die attach or SMT engineering using ASM, ESEC, Yamaha(SMT), Datacon, others die bonder or SMT machine experience
3) Solder and epoxy material properties and its reliability failures knowledge
4) JMP, Minitab DOE or other statistical analysis skill will get advantages
5) Be familiar with design, process FMEA, Control plan generation
6) In-depth knowledge of power electronic packages and processes
7) Fundamental understanding of package design and material properties
8) Knowledge of power packages processes
9) Understanding of semiconductor material properties and their influence on semiconductor device behavior
10) Able to understand thermo/mechanical simulation and JMP data analysis tools is strongly desired
11) Excellent interpersonal, verbal, and written English communication skills
12) Ability to demonstrate great attention to detail
13) Are a proven self-starter
Qualifications & Requirements: 
Job description
1) Responsible from design review of new products, participate Package
and substrate(Lead frame and DBC) design review, optimize design, process characterization, generate related spec and work instruction, to be owner of qualification and customers samples to complete product qualification, initial training of operation
2) Lead potential failure modes review to define RPN into DFEMA and find counter measure to optimize design for yield, cost, quality, reliability, manufacturability, cycle time
3) Lead supplier to design required tools and jig such like magazine, spanker, stencil, epoxy dispensing nozzle
4) Characterize and generate report for solder, epoxy, SMT process against failure modes and key parameters of output variables according to D/PFMEA
5) Optimize process recipe, parameters, tools, jigs to meet die attach cost, quality, yield, UPH, reliability, manufacturability to hands over to operation department
6) Validate design rule by process characterization
7) Generate process quality specs, recipe, D/PFMEA, Control plan, work instruction to train operation
8) Resolve technical issues from characterization, qualification, and customer samples
9) Owner of correspond process to meet required process success criteria
10) Generate new equipment PO spec leading cross functional team from operation and support department
Benefits & Welfare: 
Pay five insurance and one housing fund, provide accommodation, shuttle bus, canteen,enjoy all the holidays and benefits stipulated
Employer Introduction: 
恒诺微电子集团是东南亚领先的独立的 “电子制造服务生产商(EMS)”。
We manufacture the highest quality products and continuously upgrade our capabilities to meet our customers’ current and future requirements within the areas of Microelectronics, Semiconductor Integrated Circuit “IC” and Liquid Crystal on Silicon (LCOS) assembly and test.
The Group manufactures products in 6 production facilities, employing more than 10,000 employees worldwide. The plants are located in Thailand, China, USA and Cambodia, with a total manufacturing floor space of over 1,100,000 square feet.
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Address: Unit 403, ZhongLian Building, No.88(A), Anwai Avenue, Dongcheng District, Beijing 100011 China
Telephone: 400-780-1070    (Office) 010-64217250  021-61900630  0755-66810935     Fax: 010-64217809
京ICP备13019686号-6 公安备案号11010102005430 增值电信业务经营许可证:京B2-20214253
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