Power semiconductor mold and trim/form engineer
This is a regular Job Posting
Office Address: 浙江省嘉兴市秀洲高新技术产业开发区恒诺路18号
Industry & Field: Semiconductors
Salary: Monthly Salary: RMB (CNY) 18,000 to 25,000
Phone Number: 0573-83528161
Refresh Date: Jun. 24, 2022
Expiration Date: Aug. 23, 2022
b. Job description
1) Responsible from design review of new products, participate Package
and substrate(Lead frame and DBC) design review, optimize design, process characterization, generate related spec and work instruction, to be owner of qualification and customers samples to complete product qualification, initial training of operation
2) Lead potential failure modes review to define RPN into DFEMA and find counter measure to optimize design for yield, cost, quality, reliability, manufacturability, cycle time
3) Lead supplier to design required tools and jig such like mold die, trim/form dies, magazine, tubes, or tray
4) Characterize and generate report for mold , trim and from related failure modes and key parameters of output variables according to D/PFMEA
5) Optimize process recipe, parameters, tools, jigs to meet die attach cost, quality, yield, UPH, reliability, manufacturability to hands over to operation department
6) Validate design rule by process characterization
7) Generate process quality specs, recipe, D/PFMEA, Control plan, work instruction to train operation
8) Resolve technical issues from characterization, qualification, and customer samples
9) Owner of correspond process to meet required process success criteria
10) Generate new equipment PO spec leading cross functional team from operation and support department
Qualifications & Requirements:
a. Requirements
1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science, or equivalent
2) Min 3 years' experience in Discrete or Module semiconductor mold, trim and form process
3) Epoxy mold compound properties and its reliability failures knowledge
4) Trim/From mechanical design understanding against delamination, package crack and bent lead
5) JMP, Minitab DOE or other statistical analysis skill will get advantages
6) Be familiar with design, process FMEA, Control plan generation
7) In-depth knowledge of power electronic packages and processes
8) Fundamental understanding of package design and material properties
9) Knowledge of power packages processes
10) Understanding of semiconductor material properties and their influence on semiconductor device behavior
11) Able to understand thermo/mechanical simulation and JMP data analysis tools is strongly desired
12) Excellent interpersonal, verbal, and written English communication skills
13) Ability to demonstrate great attention to detail
14) Are a proven self-starter
Pay five insurances and one housing fund, 15 monthly salary a year, provide accommodation, shuttle bus, canteen, enjoy all the holidays and benefits stipulated
恒诺微电子集团是东南亚领先的独立的 “电子制造服务生产商（EMS）”。
我们生产最高质量的产品并不断提升我们的能力来满足客户当前和未来在下列领域的要求：微电子，半导体集成电路和硅基液晶（LCOS）的组装和测试。
该集团有6个生产基地，全球雇用员工超过10000名。工厂位于泰国、中国、美国和柬埔寨，总制造厂房面积超过1,100,000平方英尺。
THE LEADING INDEPENDENT ELECTRONICS MANUFACTURING SERVICE (EMS) COMPANY IN SOUTH EAST ASIA
We manufacture the highest quality products and continuously upgrade our capabilities to meet our customers’ current and future requirements within the areas of Microelectronics, Semiconductor Integrated Circuit “IC” and Liquid Crystal on Silicon (LCOS) assembly and test.
The Group manufactures products in 6 production facilities, employing more than 10,000 employees worldwide. The plants are located in Thailand, China, USA and Cambodia, with a total manufacturing floor space of over 1,100,000 square feet.
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