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Job Position Information

Code: C6030
Power semiconductor mold and trim/form engineer
This is a regular Job Posting
Employer: 恒诺微电子(嘉兴)有限公司
Working Place: Suzhou
Office Address: 浙江省嘉兴市秀洲高新技术产业开发区恒诺路18号
Job Type: Full Time
Industry & Field: Semiconductors
Vacancies: 1
Salary: Monthly Salary: RMB (CNY) 18,000 to 25,000
Phone Number: 0573-83528161
Contact Name: Eva
Refresh Date: Aug. 18, 2022
Expiration Date: Aug. 23, 2022     Expired
Job Description: 
b. Job description
1) Responsible from design review of new products, participate Package
and substrate(Lead frame and DBC) design review, optimize design, process characterization, generate related spec and work instruction, to be owner of qualification and customers samples to complete product qualification, initial training of operation
2) Lead potential failure modes review to define RPN into DFEMA and find counter measure to optimize design for yield, cost, quality, reliability, manufacturability, cycle time
3) Lead supplier to design required tools and jig such like mold die, trim/form dies, magazine, tubes, or tray
4) Characterize and generate report for mold , trim and from related failure modes and key parameters of output variables according to D/PFMEA
5) Optimize process recipe, parameters, tools, jigs to meet die attach cost, quality, yield, UPH, reliability, manufacturability to hands over to operation department
6) Validate design rule by process characterization
7) Generate process quality specs, recipe, D/PFMEA, Control plan, work instruction to train operation
8) Resolve technical issues from characterization, qualification, and customer samples
9) Owner of correspond process to meet required process success criteria
10) Generate new equipment PO spec leading cross functional team from operation and support department
Qualifications & Requirements: 

a. Requirements
1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science, or equivalent
2) Min 3 years' experience in Discrete or Module semiconductor mold, trim and form process
3) Epoxy mold compound properties and its reliability failures knowledge
4) Trim/From mechanical design understanding against delamination, package crack and bent lead
5) JMP, Minitab DOE or other statistical analysis skill will get advantages
6) Be familiar with design, process FMEA, Control plan generation
7) In-depth knowledge of power electronic packages and processes
8) Fundamental understanding of package design and material properties
9) Knowledge of power packages processes
10) Understanding of semiconductor material properties and their influence on semiconductor device behavior
11) Able to understand thermo/mechanical simulation and JMP data analysis tools is strongly desired
12) Excellent interpersonal, verbal, and written English communication skills
13) Ability to demonstrate great attention to detail
14) Are a proven self-starter
Benefits & Welfare: 
Pay five insurances and one housing fund, 15 monthly salary a year, provide accommodation, shuttle bus, canteen, enjoy all the holidays and benefits stipulated
Employer Introduction: 
恒诺微电子集团是东南亚领先的独立的 “电子制造服务生产商(EMS)”。
We manufacture the highest quality products and continuously upgrade our capabilities to meet our customers’ current and future requirements within the areas of Microelectronics, Semiconductor Integrated Circuit “IC” and Liquid Crystal on Silicon (LCOS) assembly and test.
The Group manufactures products in 6 production facilities, employing more than 10,000 employees worldwide. The plants are located in Thailand, China, USA and Cambodia, with a total manufacturing floor space of over 1,100,000 square feet.
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Address: Unit 403, ZhongLian Building, No.88(A), Anwai Avenue, Dongcheng District, Beijing 100011 China
Telephone: 400-780-1070    (Office) 010-64217250  021-61900630  0755-66810935     Fax: 010-64217809
京ICP备13019686号-6 公安备案号11010102005430 增值电信业务经营许可证:京B2-20214253
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